Products

B Thermal Pad

B Thermal Pad

Thermal interface materials (TIM) manage and transfer heat within devices, ensuring components operate within safe temperature ranges to enhance performance and reliability. With excellent thermal conductivity, TIMs effectively transfer heat from high-temperature areas to cooling regions, preventing overheating. High thermal conductivity is crucial for high-performance electronic devices. TIMs must also have good contact pressure and adhesion to ensure optimal contact between surfaces and heat sinks, reducing thermal resistance and improving heat transfer efficiency. Common TIM types include thermal grease, thermal adhesives, and thermal silicone pads, selected based on application needs and environmental conditions.

b1. Si-Gap Pad

  • Cooler Assemble Film, CoolerAF® S Series, Si-Gap Pad
    Cooler Assemble Film, CoolerAF® S Series, Si-Gap Pad

    flexible and soft thermal interface material

b2. Acrylic-Gap Pad

  • Cooler Assemble Film, CoolerAF® A Series, Acrylic-Gap Pad
    Cooler Assemble Film, CoolerAF® A Series, Acrylic-Gap Pad

    flexible and soft thermal interface material

b3. PCM-Gap Pad

  • Cooler Assemble Film, CoolerAF® P Series, PCM Gap Pad
    Cooler Assemble Film, CoolerAF® P Series, PCM Gap Pad

    an effective substitute for thermal grease.

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