Products

Thermal Interface Materials

Thermal Interface Materials

Thermal interface materials (TIM) manage and transfer heat within devices, ensuring components operate within safe temperature ranges to enhance performance and reliability. With excellent thermal conductivity, TIMs effectively transfer heat from high-temperature areas to cooling regions, preventing overheating. High thermal conductivity is crucial for high-performance electronic devices. TIMs must also have good contact pressure and adhesion to ensure optimal contact between surfaces and heat sinks, reducing thermal resistance and improving heat transfer efficiency. Common TIM types include thermal grease, thermal adhesives, and thermal silicone pads, selected based on application needs and environmental conditions.

IC-Package Thermal Grease TIM1

  • IC-Package Thermal Grease TIM1
    IC-Package Thermal Grease TIM1

    TCG Series is suitable for application on IC and m

Thermal Grease TIM2

  • Thermal Grease TIM2
    Thermal Grease TIM2

    suitable for application on CPU, GPU and LED devic

Si-Gap Pad

  • Cooler Assemble Film, CoolerAF® S Series, Si-Gap Pad
    Cooler Assemble Film, CoolerAF® S Series, Si-Gap Pad

    flexible and soft thermal interface material

Acrylic-Gap Pad

  • Cooler Assemble Film, CoolerAF® A Series, Acrylic-Gap Pad
    Cooler Assemble Film, CoolerAF® A Series, Acrylic-Gap Pad

    flexible and soft thermal interface material

PCM-Gap Pad

  • Cooler Assemble Film, CoolerAF® P Series, PCM Gap Pad
    Cooler Assemble Film, CoolerAF® P Series, PCM Gap Pad

    an effective substitute for thermal grease.

Thermal Encapsulant

  • Thermal Encapsulant
    Thermal Encapsulant

    type of liquid slurry with good fluidity and therm

Liquid Metal

  • Liquid Metal
    Liquid Metal

    LM-TIM is a special type of heat dissipation

Lid Adhesive

  • Lid Adhesive
    Lid Adhesive

    TCG Series is suitable for application on IC and m

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