b1. Si-Gap Pad
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Cooler Assemble Film, CoolerAF® S Series, Si-Gap Pad
flexible and soft thermal interface material
B. Thermal Pad
GTA thermal gap pads provide thermal interfaces between electronic components and heat sinks, helping accommodate gaps and surface irregularities for improved thermal contact. The portfolio includes silicone-based thermal pads, silicone-free / silicone-oil-free thermal pads, and phase-change thermal pads (PCM), offering options for different modules, assembly processes, and reliability requirements.
Three Thermal Pad Material Platforms
Silicone-Based Thermal Pads
Soft and compressible materials that accommodate component height differences and assembly gaps; commonly used in 5G communication, automotive electronics, and PCB modules.
Silicone-Free / Silicone-Oil-Free Thermal Pads
Material options for applications sensitive to silicone-related contamination, such as optical communication modules and IC packaging; process compatibility and reliability should be verified.
Phase-Change Thermal Pads (PCM)
Maintain a sheet-like form at room temperature and gradually soften as operating temperature rises, improving conformity to microscopic surface irregularities in CPU/GPU, server, and cold-plate interfaces.
Selection considerations: gap size, contact pressure, thermal conductivity, actual interfacial thermal resistance, compression / phase-change behavior, and contamination-control requirements should be evaluated under the intended module conditions.
b2. Acrylic-Gap Pad
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Cooler Assemble Film, CoolerAF® A Series, Acrylic-Gap Pad
flexible and soft thermal interface material
b3. PCM-Gap Pad
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Cooler Assemble Film, CoolerAF® P Series, PCM Gap Pad
an effective substitute for thermal grease.
