Thermal Encapsulant is a type of liquid slurry with good fluidity and thermal conductivity. It is often used as a thermal conductive medium in electronic or battery modules. It can flow at room temperature and within a rated time to cover and fill electronic devices. After curing of at room temperature, Thermal Encapsulant can play the functions of dustproof, moisture-proof, shockproof, insulation and heat conduction for many electronic devices in the module.
Thermal encapsulant can be categorized based on the polymer matrix type and thermal conductivity level as follows:
| Classification Basis | Category | Description |
|---|---|---|
| Polymer Matrix | Three Main Types | Epoxy-based thermal encapsulant, Polyurethane-based thermal encapsulant, Silicone-based thermal encapsulant |
| Thermal Conductivity | Three Main Types |
0.6–0.8 W/m·K: General grade thermal encapsulant |
Thermal Conductive Encapsulant, TCE Series
| Property | Unit | TCE-S0825 | TCE-S1635 | TCE-S2650 | |
|---|---|---|---|---|---|
| Color | Part A | - | White | White | White |
| Part B | - | Grey | Grey | Grey | |
| Mixed | - | Grey | Grey | Grey | |
| Mixed Viscosity | mPa·s | 2,800 | 4,200 | 10,600 | |
| Pot Life | hour | 2 | 2 | 2 | |
| Cure Time | hour | 24 | 24 | 24 | |
| Durometer | Shore A | 25 | 35 | 50 | |
| Thermal Conductivity | W/m·K | 0.8 | 1.6 | 2.6 | |
| Dielectric Strength | kV/mm | 9 | 9 | 11 | |
| Volume Resistivity | ohm·cm | 1.6x1015 | 1.6x1015 | 1.8x1015 | |
50 g Syringe, 5 L container, 20 L container
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