Thermal Encapsulant

Thermal Encapsulant is a type of liquid slurry with good fluidity and thermal conductivity. It is often used as a thermal conductive medium in electronic or battery modules. It can flow at room temperature and within a rated time to cover and fill electronic devices. After curing of at room temperature, Thermal Encapsulant can play the functions of dustproof, moisture-proof, shockproof, insulation and heat conduction for many electronic devices in the module.

The composition of thermal encapsulant includes polymer matrix and thermal conductive powder, which are transformed into thermal encapsulant via stir mixing.

• Low viscosity, good fluidity, can be cured at room temperature or quickly cured at high temperature.
• Low shrinkage, thermal shock resistance, waterproof performance.