Application

IC Packaging
Semiconductor Applications

IC Packaging

Our chip packaging materials offer exceptional protection and thermal conductivity, enhancing the performance and reliability of electronic components. These materials are designed to protect and enhance the performance of semiconductor devices, ensuring they meet the rigorous requirements of harsh environmental conditions.

IC-Package Thermal Grease TIM1

  • IC-Package Thermal Grease TIM1
    IC-Package Thermal Grease TIM1

    TCG Series is suitable for application on IC and m

Flux Cleaner

  • Flux Cleaner
    Flux Cleaner

    low surface tension and organic solution used for

Temporary Bonding Materials

Lid Adhesive

  • Lid Adhesive
    Lid Adhesive

    TCG Series is suitable for application on IC and m

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