Application

IC Packaging
Semiconductor Applications

IC Packaging

Our chip packaging materials offer exceptional protection and thermal conductivity, enhancing the performance and reliability of electronic components. These materials are designed to protect and enhance the performance of semiconductor devices, ensuring they meet the rigorous requirements of harsh environmental conditions.

1c2. Packaging Thermal Grease

  • IC-Package Thermal Grease TIM1
    IC-Package Thermal Grease TIM1

    TCG Series is suitable for application on IC and m

a3. Flux Cleaner

  • Flux Cleaner
    Flux Cleaner

    low surface tension and organic solution used for

c4. Temporary Bonding Adhesive

  • Temporary Bonding Adhesive
    Temporary Bonding Adhesive

    Temporary Bonding Adhesive for Wafer Processing

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