Application

IC Packaging
Semiconductor Applications

IC Packaging

Our chip packaging materials offer exceptional protection and thermal conductivity, enhancing the performance and reliability of electronic components. These materials are designed to protect and enhance the performance of semiconductor devices, ensuring they meet the rigorous requirements of harsh environmental conditions.

Thermal Grease

  • Thermal Grease
    Thermal Grease

    paste-like substance with good thermal conductivit

Underfill

  • Underfill
    Underfill

    a one-component epoxy composite material with high

Flux Cleaner

  • Flux Cleaner
    Flux Cleaner

    low surface tension and organic solution used for

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