E. Semiconductor Tape
GTA semiconductor process tapes cover two main applications: wafer dicing and wafer back grinding. The film substrate, adhesive-layer thickness, and adhesion/release behavior are designed to provide wafer fixation, surface protection, and controlled removal. Back grinding solutions are further grouped into Non-UV, UV-release, and DBG-specific tapes.
Two Processes · Four Tape Solutions
01｜Wafer Dicing
Wafer support during dicing; UV-reduced adhesion
02｜Non-UV Back Grinding
Removal without UV exposure under process-specific conditions
03｜UV-Release Grinding
UV-release adhesion for post-grinding removal
04｜Dicing Before Grinding
Compatible with partial dicing, grinding, and die separation
Selection factors: wafer and bump profile, cushioning, backing film, peel adhesion, UV equipment availability, and residue control.
Semiconductor Tapes | Process Selection Guide
Choose a suitable tape series by process and debonding method.
| Tape Category | Debonding | Models / Selection Criteria |
|---|---|---|
| e1 | Dicing Tape | UV release |
UO090 UO110
Supports wafers during dicing; reduced adhesion after 365 nm UV exposure
|
| e2 | Non-UV BG Tape | No UV needed |
NO205-BC NO170-TC NO130-TC NT595-DL
Water resistance, cushioning, and warpage/residue control during back grinding
|
| e3 | UV BG Tape | UV release |
UT170-DL UT260-DL UT440-DL UO210-DL
Holds wafers during grinding and enables easier removal after UV exposure
|
| e4 | DBG Tape | UV release |
UC165-DL
For dicing-before-grinding (DBG), including partial dicing, grinding and die separation
|
Note: This table is a preliminary process selection guide. Refer to the latest Technical Data Sheet (TDS) for each grade for thickness, adhesion and test conditions.
Tape Structure Reference Images
Semiconductor Tapes | BG vs. DBG Process Comparison
Conventional Back Grinding (BG) vs. Dicing Before Grinding (DBG)
Wafer back-grinding tapes provide surface protection, water resistance, fixation, and stress cushioning during wafer thinning. BG (Back Grinding) and DBG (Dicing Before Grinding) describe different process sequences, whereas UV and Non-UV describe adhesive release methods. These are two distinct ways of classifying grinding tapes.
Conventional Back Grinding (BG)
A protective tape is applied to the wafer front side before backside grinding. Depending on equipment and removal requirements, the process may use Non-UV BG tapes (NO and NT series) or UV-release BG tapes (UT and UO series).
Dicing Before Grinding (DBG)
DBG-specific grinding tapes (UC series) support processes involving partial dicing, backside grinding, and die separation, with an emphasis on edge protection, stable fixation, and post-grinding removal.
BG / DBG Process Illustration
Back-Grinding Tape Material Structure Comparison
Tape series use different adhesive-layer constructions and backing materials to suit the process and release method. The table summarizes series-level selection information.
| Series | Process / Release | Adhesive Layers | Backing Film |
|---|---|---|---|
| NO | BG / Non-UV | Single layer | PO |
| NT | BG / Non-UV | Dual layer | PET |
| UT | BG / UV release | Dual layer | PET |
| UO | BG / UV release | Dual layer | PO |
| UC | DBG / UV release | Dual layer | Composite PET |
Note: The table summarizes typical series-level material structures. Actual adhesive-layer thickness, backing films, adhesion, and release conditions are subject to the latest TDS for each grade.
