C. Thermal / Composite Materials
GTA provides thermal interface and bonding materials for semiconductor packaging, electronics cooling, and precision assembly. Five product families cover chip interfaces, lid attachment, gap filling, temporary wafer bonding, and structural joining.
Five Product Families
C1 IC Package Paste | TIM1
C2 Lid Thermal Adhesive
C3 Thermal Grease | TIM2
C4 Temporary Bonding | TBA
C5 Structural Adhesives | STIFBOND™
Select materials by thermal needs, curing or debonding processes, and reliability requirements.
c2. Packaging Thermal Gel
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Thermally conductive adhesive (Lid Adhesive)
Thermally conductive adhesive (Lid Adhesive) desig
