Underfill

Underfill is a one-component epoxy composite material with high viscosity, high temperature fluidity, and can be filled at the bottom of integrated circuit chips through capillary action. It is heated and solidified to form a strong filling layer. Improve the structural strength and reliability of electronic components.

Underfill is a composite material composed of ceramic powder and epoxy resin. The underfill cured between the chip and the carrier board has a low coefficient of thermal expansion(CTE), so it can alleviate temperature shock and absorb internal stress of the overall electronic components Besides, Underfill can completely cover fine circuit solder joints, strengthening the connection between the chip and the carrier board. According to the structure of the chip package, Underfill can be divided into the following categories.