b1. Si-Gap Pad
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Cooler Assemble Film, CoolerAF® S Series, Si-Gap Pad
flexible and soft thermal interface material
ICT Applications
Power Modulus Thermal Management
Our thermal management materials are designed to enhance heat dissipation efficiency for power supplies and modules. These materials maintain optimal operating temperatures, ensuring reliable and efficient performance in demanding applications.
b3. PCM-Gap Pad
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Cooler Assemble Film, CoolerAF® P Series, PCM Gap Pad
an effective substitute for thermal grease.
