Application

Power Modulus Thermal Management
ICT Applications

Power Modulus Thermal Management

Our thermal management materials are designed to enhance heat dissipation efficiency for power supplies and modules. These materials maintain optimal operating temperatures, ensuring reliable and efficient performance in demanding applications.

Thermal Grease

Thermal Pad

  • Cooler Assemble Film Thermal Pad
    Cooler Assemble Film Thermal Pad

    flexible and soft thermal interface material

Thermal Encapsulant

  • Thermal Encapsulant
    Thermal Encapsulant

    type of liquid slurry with good fluidity and therm

Liquid Metal Paste

  • Liquid Metal paste
    Liquid Metal paste

    LM-TIM is a special type of heat dissipation

PCM Pad

  • PTM Pad
    PTM Pad

    an effective substitute for thermal grease.

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