Products

Thermal Interface Materials

Thermal interface material, TIM 2, Thermal Grease, HSG Series

Thermal Grease, HSG Series is suitable for application on CPU, GPU and LED device. HSG thermal grease has excellent thermal conductivity, viscosity stability, screen-printing performance, and has long-term outstanding temperature resistance.

Specification

Item Unit HSG-601 HSG-331 HSG-501
Color - Gray Paste Gray Paste Gray Paste
Viscosity Low Strain Rate Pa·s 1000 550 1500
High Strain Rate 170 80 120
Specific Gravity - 2.3 2.3 2.2
Thermal Resistance* °C·cm²/W 0.1 0.18 0.05
Thermal Conductivity** W/ solvent W/m·K 4.3 - -
W/O solvent 6.0 3.2 5.1
Bond Line Thickness @40 psi µm 62 45 30

* Hot plate method, ASTM D5470, LW-9389.  **Hot disk method, ISO 22007-2, TPS 500 S.

Structure

  

Usage Scenarios

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