TIM2 Thermal Grease | Applications & Technical Properties
Review the heat-transfer pathway, material platform, and representative in-house test data to support thermal interface material selection.
TIM2 Thermal Interface Structure
Cold Plate / Heat Sink
TIM2 Thermal Grease
IHS / Package
GPU / CPU / Power Module
The thermal grease fills microscopic gaps between solid surfaces. Thermal resistance and BLT depend on pressure, surface roughness, and application conditions.
Interfacial Thermal Resistance
Evaluate heat-transfer performance using consistent pressure and temperature conditions.
Long-Term Stability
Consider resistance, viscosity, and volatilization or dry-out behavior during high-temperature aging.
Processability
Compatible process planning for dispensing, spreading, and automated assembly.
Cold-Plate Compatibility
Surface flatness, roughness, clamping pressure, and BLT should be evaluated together.
Typical Application Scenario
TIM2 thermal grease is dispensed between the electronic component and the heat sink, followed by cold-plate or heat-sink assembly to create a continuous heat-transfer path.
Non-Silicone / Silicone-Oil-Free Thermal Grease | Representative Properties
The following are representative test data for GTA grades. Compare results only under equivalent test conditions; refer to the latest TDS for actual specifications.
| Property | Test Condition / Unit | HSG-A501 | HSG-A601 |
|---|---|---|---|
| Material Type | — | Non-silicone / Silicone-oil-free | Non-silicone / Silicone-oil-free |
| Viscosity | Pa·s | 1,930 | 1,170 (low strain rate); 300 (high strain rate) |
| Specific Gravity | — | 2.2 | 2.2 |
| Non-Volatile Content | % | 150°C × 24 h | 99.5 | 99.1 |
| Thermal Conductivity | W/m·K | Hot Disk | 5.0 | 5.3 (with solvent); 5.9 (without solvent) |
| Thermal Resistance | °C·cm²/W | 40 psi, 80°C | 0.045 | 0.10 |
| Bond-Line Thickness (BLT) | mm | 40 psi, 30°C | 0.020 | 0.046 |
Note: HSG-A601 viscosity values are reported separately for low and high strain rates; thermal conductivity values are reported for with-solvent and without-solvent conditions. These are not single measurements under identical test conditions. Refer to the technical documentation for the viscosity test rate used for HSG-A501.
Silicone-Based Thermal Grease | Representative Properties
The following values are representative data for HSG-S501; actual performance should be confirmed using the latest TDS and application conditions.
| Property | Test Condition / Unit | HSG-S501 |
|---|---|---|
| Material Type | — | Silicone-based |
| Viscosity | Pa·s | 1,800 |
| Specific Gravity | — | 2.2 |
| Non-Volatile Content | % | 99.9 |
| Thermal Conductivity | W/m·K | 5.0 |
| Thermal Resistance | °C·cm²/W | 40 psi, 80°C | 0.04 |
| Bond-Line Thickness (BLT) | mm | 40 psi, 30°C | 0.020 |
High-Temperature Aging & Reliability | Silicone-Free Thermal Grease
Silicone-free thermal greases HSG-A501 and HSG-A601 were subjected to high-temperature aging in a forced-air convection oven at 150°C for up to 2,000 hours. Thermal resistance was measured at scheduled intervals to evaluate heat-transfer stability under elevated-temperature storage conditions.
HSG-A501 | 150°C × 2,000 h
Thermal resistance changed from 0.044 initially to 0.048 °C·cm²/W at 2,000 h. The highest recorded value was 0.049 at 1,500 h, indicating a limited overall variation during the test.
HSG-A601 | 150°C × 2,000 h
Thermal resistance changed from 0.097 initially to 0.119 °C·cm²/W at 2,000 h, approximately 1.23 times the initial value. The test report states that no hardening, drying, or disintegration at room temperature was observed during this aging evaluation.
Representative Thermal Resistance Data
| Aging time | HSG-A501 (°C·cm²/W) |
HSG-A601 (°C·cm²/W) |
|---|---|---|
| 0 h | 0.044 | 0.097 |
| 1,000 h | 0.047 | 0.109 |
| 1,500 h | 0.049 | 0.111 |
| 2,000 h | 0.048 | 0.119 |
Both grades have thermal resistance records over 2,000 h at 150°C. Their initial values and aging trends differ; material selection should consider the actual interface and test conditions.
HSG-A501｜150°C × 2,000 h
HSG-A501: thermal resistance ranged from approximately 0.040 to 0.049 °C·cm²/W during the test.
HSG-A601｜150°C × 2,000 h
HSG-A601: thermal resistance ranged from approximately 0.097 to 0.119 °C·cm²/W during the test.
Test conditions: 150°C in a forced-air convection oven; thermal resistance measured at scheduled intervals. These results represent storage-aging tests, not guaranteed service life or shipping specifications. They should not be directly extrapolated to a specified service life at another operating temperature. Refer to the latest TDS for product specifications.
Packaging & Technical Support
1 kg per can. Grade availability, packaging, and application conditions should be confirmed against current documentation and with the sales team. Selection support can be based on module structure, contact pressure, BLT, and target thermal resistance.
Note: The above values are representative test results and do not constitute guaranteed shipping specifications. Actual product specifications are subject to the latest Technical Data Sheet (TDS) for each grade.
