Thermal Grease

Thermal Grease is a paste-like substance with good thermal conductivity. It is a thermal interface material and is mainly used at the interface between radiators and heat sources, such as chips and inductors. The main function of thermal paste is to fill the porous surface, replace air, reduce interface thermal resistance, and enhance thermal conductivity efficiency.

Thermal Grease is composed of liquid polymer and thermal powder. Typical liquid polymers include silicon polydimethylsiloxane, polyurethane, polyacrylic acid polymers, etc. Common thermally conductive powders include aluminum powder, silver powder, aluminum oxide, zinc oxide, boron nitride, and aluminum nitride. Thermal paste can be classified into "TIM1" and "TIM2" according to the application strucure.

TIM1 is a thermosetting Thermal Grease that is used between the chip and the heat sink of the semiconductor package.

• Thermal cured material.
• Appropriate hardness and elongation characteristics.
• No delamination and low void at high temperature.