Specification
Thermal Grease TIM2
Thermal Grease, HSG Series is suitable for application on CPU, GPU and LED device. HSG thermal grease has excellent thermal conductivity, viscosity stability, screen-printing performance, and has long-term outstanding temperature resistance.
Specification
| Item | Unit | HSG-601 | HSG-331 | HSG-501 | |
|---|---|---|---|---|---|
| Color | - | Gray | Gray | Gray | |
| Viscosity | Low Strain Rate | Pa·s | 1000 | 550 | 1500 |
| High Strain Rate | 170 | 80 | 120 | ||
| Specific Gravity | - | 2.3 | 2.3 | 2.2 | |
| Thermal Resistance* | °C·cm²/W | 0.1 | 0.18 | 0.05 | |
| Thermal Conductivity** | W/ solvent | W/m·K | 4.3 | - | - |
| W/O solvent | 6.0 | 3.2 | 5.1 | ||
| Bond Line Thickness @40 psi | µm | 62 | 45 | 30 | |
* Hot plate method, ASTM D5470, LW-9389. **Hot disk method, ISO 22007-2, TPS 500 S.
Pack Size
1L
