A. Liquid Materials
GTA’s liquid materials are developed for semiconductor wafer processing, IC packaging, and electronic-device protection. The portfolio covers dicing-process protection, precision cleaning, waterproofing, and surface modification.
From laser-grooving and plasma-dicing protection to diamond-blade dicing fluids, flux cleaners, conformal coatings, membrane-keyboard waterproof adhesives, and fluorine-free hydrophobic treatments, these material solutions can be selected to suit different processes and substrates, supporting process compatibility, surface cleanliness, and long-term protection.
Wafer Process Protection Precision Cleaning Electronic Waterproofing Surface Modification
a2. CleanDice
a3. Flux Cleaner
a4. Conformal Coating III~V
a5. Membrane Adhesive
a6. PFAS-Free Water-Repellent Coating
a7. Plasma Dicing Protection Coating
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Plasma Dicing Protection Coating
