Products

Liquid Materials

CleanDice

Packing unit: 1 Gallon

CleanDice is an aqueous solution with low surface tension and high dilution, which can improve the production yield of wafer dicing process.

CleanDice is is a water-based polymer solution, which provide both chemical and physical effects. CleanDice can quickly disperse wafer debris generating in the blade dicing, and CleanDice prevent debris from accumulating on the wafer surface, thus reducing corrosion and contamination problem.

  • Low surface tension, and excellent lubrication effect.
  • Amphiphilic ingredient design, quickly take away debris and improve wafer cleanliness.
  • Extend the life of saw blade.

Specification

Item Unit SD-18D SD-18FA WS-80 SD-18S
pH - 7±1 4.5±1 5±1 9±1
Viscosity cP@25˚C 1.5±0.5 13±3 105±20 2.8±1
Conductivity - 195±15 700±20 200±20 240±40
Specific Gravity - 1.008±0.01 1.016±0.01 1.016±0.01 1.004±0.002
Surface Tension Dyne/cm 35±1 29±2 29±2 29.5±1
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