Wafer Dicing Process Applications
Wetting, dispersion and cleaning assistance to support surface management during dicing.
01Wetting & Lubrication
The low-surface-tension formulation wets the dicing area and provides lubrication.
02Debris Dispersion
Particles generated during blade dicing are dispersed to reduce localized accumulation.
03Cleaning Assistance
Helps carry particles away from the wafer surface and reduce contamination and corrosion risks.
Product Technical Specifications
Representative physical properties of four product grades for process selection and evaluation.
| Property | Unit | SD-18D | SD-18FA | WS-80 | SD-18S |
|---|---|---|---|---|---|
| pH | — | 7 ± 1 | 4.5 ± 1 | 5 ± 1 | 9 ± 1 |
| Viscosity | cP @ 25°C | 1.5 ± 0.5 | 13 ± 3 | 105 ± 20 | 2.8 ± 1 |
| Conductivity | µS/cm | 195 ± 15 | 700 ± 20 | 950 ± 50 | 240 ± 40 |
| Specific Gravity | — | 1.008 ± 0.01 | 1.016 ± 0.01 | 1.016 ± 0.01 | 1.004 ± 0.002 |
| Surface Tension | mN/m | 35 ± 1 | 29 ± 2 | 29 ± 2 | 29.5 ± 1 |
Packaging 1-gallon HDPE container.
Note: The above data are for reference only and do not constitute guaranteed product specifications. Actual specifications are subject to the latest Technical Data Sheet (TDS) for each product.
