A. Liquid Materials

Laser Grooving Solution

GTA Laser Grooving Protection Solution is a water-based polymer formulation designed for spin coating on integrated-circuit wafers. It forms a temporary, heat-resistant protective film on the wafer surface. During laser grooving, the coating helps reduce the risk of cutting-lane chipping, dielectric-layer delamination, and surface damage caused by processing debris, supporting process quality and yield.

Key Technical Features

Process Cooling

Vaporization of organic components during processing helps reduce localized heat and improve laser-grooving resolution.

Heat-Resistant Film Protection

A protective polymer film on the wafer helps reduce debris splashing and scratching of circuit features.

Pure-Water Removal

The temporary water-based protective coating can be removed by rinsing with pure water after laser grooving.

Typical Process Flow

Spin Coating→Protective Film→Laser Grooving→Pure-Water Rinse

Application & Process Illustration

Illustration of spin coating, laser grooving and pure-water rinsing using laser grooving protective solution

The laser grooving protective solution forms a temporary protective layer through spin coating, protecting the wafer during processing. The coating is removed with a pure-water rinse after processing.

Technical Specifications

Representative specifications: LS-168F, LS-168P and LG-168/268

Item	Unit	LS-168F	LS-168P	LG-168/268
pH	—	3.5 ± 1	4.5 ± 1	4.5 ± 1
Viscosity	cP @ 25°C	60 ± 5	64 ± 6	220 ± 30
Specific Gravity	—	1.04 ± 0.01	1.03 ± 0.01	1.04 ± 0.03
Surface Tension	mN/m	42 ± 5	42 ± 5	45 ± 5
Water Solubility	—	Y	Y	Y

Y indicates water solubility.

Packaging

5 L / 20 L HDPE containers.

Note: The above data are for reference only and do not constitute guaranteed product specifications. Please refer to the latest Technical Data Sheet (TDS) for each product for actual specifications.

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Laser Grooving Solution