Specification
Item | Unit | LS-168F | LS-168P | LG-168 |
---|---|---|---|---|
pH | - | 3.5±1 | 4.5±1 | 4.5±1 |
Viscosity | cP@25˚C | 60±5 | 64±6 | 220±30 |
Specific Gravity | - | 1.04±0.01 | 1.03±0.01 | 1.04±0.03 |
Surface Tension | mN/m | 42±5 | 42±5 | 45±5 |
Water Solubility | - | Y | Y | Y |
Laser Grooving Solution is a water-based polymer solution, which could be spin-coated on the surface of the integrated circuit wafer to form a temperature-resistant polymer thin film. During laser grooving process, the fluid can improve production yield and eliminate quality problems such as cutting track cracking and dielectric layer peeling.
Item | Unit | LS-168F | LS-168P | LG-168 |
---|---|---|---|---|
pH | - | 3.5±1 | 4.5±1 | 4.5±1 |
Viscosity | cP@25˚C | 60±5 | 64±6 | 220±30 |
Specific Gravity | - | 1.04±0.01 | 1.03±0.01 | 1.04±0.03 |
Surface Tension | mN/m | 42±5 | 42±5 | 45±5 |
Water Solubility | - | Y | Y | Y |
5 L and 20 L HDPE Containers
建議您使用以下瀏覽器觀看本網站,
以獲得最佳瀏覽效果。