Products

Liquid Materials

Laser Grooving Coating

Laser Grooving Solution is a water-based polymer solution, which could be spin-coated on the surface of the integrated circuit wafer to form a temperature-resistant polymer thin film.  During laser grooving process, the fluid can improve production yield and eliminate quality problems such as cutting track cracking and dielectric layer peeling.

  • Achieve cooling effect through vaporization of organic materials and improve laser grooving resolution
  • Rigid polymer film, prevents debris from splashing and scratching integrated circuits on wafer.
  • Temporary coating, easily removed by rinsing with pure water

Specification

Item Unit LS-168F LS-168P LG-168
pH - 3.5±1 4.5±1 4.5±1
Viscosity cP@25˚C 60±5 64±6 220±30
Specific Gravity - 1.04±0.01 1.03±0.01 1.04±0.03
Surface Tension mN/m 42±5 42±5 45±5
Water Solubility - Y Y Y

Usage Scenarios

Pack Size

5 L and 20 L HDPE Containers

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