PCM Pad

PTM Pad is an effective substitute for thermal grease. At the operating temperature of electronic products, the material changes from solid to semi-liquid, filling uneven gaps on the surface, while eliminating problems such as material pumping out, thereby reducing interface thermal Impedance and improve product reliability.

The composition of PTM Pad is a mixture of thermal conductive powder and polymer matrix with specific phase transition temperature. Via coating lamination, the mixture transform into PTM Pad. PTM Pad is a solid sheet, thin and easy to lamination. At specific temperature, the material becomes soft and flows to fill the tiny irregular contact surfaces of the heat source. At the same time, it will not be completely liquefied and pumped out, thus reducing the interface thermal resistance and improving product reliability.

• Temperature resistant and prevents material pumping out.
• High thermal conductivity effectively ensures CPU reliability.