How phase-change thermal pads work
Temperature-dependent softening helps the material conform to the mating surfaces.
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This is a generic illustration of phase-change behavior. The CoolerAF® P Series is designed to soften at operating temperatures; the diagram does not imply complete melting into a free-flowing liquid.
A｜Room temperature | Power off
A solid, preformed sheet supports easy placement, handling and positioning.
B｜Near phase-change temperature
The material gradually softens and conforms to fine gaps between the heat source and cooling surface.
C｜After cooling | Power off
It returns toward a more stable sheet-like or semi-solid state, helping maintain interface placement.
Key material benefits
Preformed sheets balance assembly convenience with effective thermal contact.
01 Handling and placement
Supplied as a sheet for straightforward module positioning and assembly.
02 Thermal interface contact
Softens at operating temperature to reduce resistance caused by microscopic gaps.
03 Process consistency
Preformed thickness reduces variation associated with grease volume and dispensing settings.
04 Pump-out risk management
Formulated to limit displacement during thermal cycling; application-specific validation is still needed.
Phase-change thermal pads vs. thermal grease
A general comparison of material handling and process characteristics, not an assessment of any specific competing product.
| Attribute | Phase-change pad | Thermal grease |
|---|---|---|
| State at room temperature | Preformed solid sheet | Paste-like material |
| Conformability at temperature | Softens near transition temperature | Depends on formulation and rheology |
| Thermal contact resistance | Can be low; depends on BLT, pressure and surfaces | Can be low; depends on BLT, pressure and surfaces |
| Application method | Sheet placement / pre-positioning | Dispensing, printing or coating |
| Bleed and contamination | Designed for positional stability | Depends on formulation, volume and processing |
| Pump-out behavior | Designed to reduce material displacement | Depends on formulation and thermal cycling |
| Thickness control | Preselected sheet thickness | Controlled by coating / dispensing and clamping |
Applications and assembly scenarios
For thermal interfaces requiring low contact resistance and repeatable assembly.
01 CPU / GPU interfaces
Between heat sources and heat spreaders, heat sinks or vapor chambers.
02 Servers / AI accelerators
Module-to-module consistency, extended operation and thermal cycling evaluation.
03 Power modules / ASICs
Sheet-based assembly between power devices and cooling structures.
CoolerAF® P Series specifications
Representative P09, P12 and P15 product data.
| Property | Unit | CoolerAF® P09 | CoolerAF® P12 | CoolerAF® P15 |
|---|---|---|---|---|
| Color | — | Gray | Gray | Gray |
| Thickness (customizable) | mm | 0.15–2.0 | 0.15–2.0 | 0.15–2.0 |
| Thickness tolerance | % | ±5 | ±5 | ±5 |
| Thermal conductivity * | W/m·K | 9.0 | 12.0 | 15.0 |
| Thermal resistance ** | °C·cm²/W | 0.07 | 0.05 | 0.03 |
| Volume resistivity | Ω·cm | >10¹⁴ | >10¹⁴ | >10¹⁴ |
| Phase-change temperature | °C | 45 | 45 | 45 |
* Hot Disk method, TPS 500 S. ** Hot plate method, ASTM D5470, LW-9389.
Packaging and supplySheet form; custom die-cut dimensions available.
Note: The above values are for reference only and are not guaranteed shipping specifications. Refer to the latest product Technical Data Sheet (TDS) for actual specifications.
