Cooler Assemble Film, CoolerAF® P Series, PCM Gap Pad|GTA Material Co., LTD.

Cooler Assemble Film, CoolerAF® P Series, PCM Gap Pad

PTM Pad is an effective substitute for thermal grease. At the operating temperature of electronic products, the material changes from solid to semi-liquid, filling uneven gaps on the surface, while eliminating problems such as material pumping out, thereby reducing interface thermal Impedance and improve product reliability.

The composition of PTM Pad is a mixture of thermal conductive powder and polymer matrix with specific phase transition temperature. Via coating lamination, the mixture transform into PTM Pad. PTM Pad is a solid sheet, thin and easy to lamination. At specific temperature, the material becomes soft and flows to fill the tiny irregular contact surfaces of the heat source. At the same time, it will not be completely liquefied and pumped out, thus reducing the interface thermal resistance and improving product reliability.

Temperature resistant and prevents material pumping out.
High thermal conductivity effectively ensures CPU reliability.

Operating Mechanism of Phase Change Thermal Pad

A_Room Temperature (Power Off)
    •Solid film→easy placement, stable positioning, no flow
B_Heat Source Reaches Phase Change Temperature (40–60 °C)
    •Material softens / becomes semi-liquid
    •Material flows into micro-gaps between heat source and heat spreader
C_Cooling (Power Off)
    •Material returns to a semi-solid state→Position remains stable, minimizing pump-out risk

`Advantages of Phase Change Thermal Pad`

Compared to conventional gap pads➜Lower interfacial thermal resistance
Compared to thermal grease➜ non-bleeding, non-flowing, no printing required
Stable mass production without the need to control paste volume, blades, or printing parameters
Excellent consistency with minimal thermal resistance variation between modules
Clean appearance with no oil bleed or silicone contamination concerns

Comparison of Phase Change Thermal Pad and Thermal Grease

Item	Phase Change Thermal Pad	Thermal Grease
Initial State	Solid	Liquid
Flowability	> 40 ^oC	YES
Contact Thermal Resistance	Low	Low
Process Friendliness	😃Excellent（direct placement）	Moderate（dispensing / printing required）
Contamination Risk	Low	🥵High
Pump-Out Risk	Low	🥵High
Thickness Control	Precise（film）	🥵Difficult to control

Application Scenarios of Phase Change Thermal Pad

CPU / GPU + Heat Spreader / Vapor Chamber
- High power dissipation, Flat contact interface
- Requirement for low thermal contact resistance
Server / AL Accelerator with Cold Plate
- High module-to-module consistency, Long-term reliability
Power Module / ASIC Thermal Modules
- Simplified assembly, Good rework ability

Usage Scenarios

Specification

Item	Unit	CoolerAF® P09 Series	CoolerAF® P12 Series	CoolerAF® P15 Series
Thickness	mm	0.15 ~ 2.0	0.15 ~ 2.0	0.15 ~ 2.0
Thickness Tolerance	%	±5	±5	±5
Color	-	Gray	Gray	Gray
Thermal Conductivity*	W/m·K	9	12	15
Thermal Impedance**	^oC·cm²/W	0.08	0.06	0.04
Phase Change Temp	^oC	45	45	45

*Hot disk method, TPS 500 S. ** Hot plate method, ASTM D5470, LW-9389. Custom thickness available.

Pack Size

Sheet form; custom die-cut dimensions available

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