Structure
Cooler Assemble Film, CoolerAF® S Series, Si-Gap Pad
A Si-Gap Pad is a solid yet soft thermal interface material, also known as a thermal silicone sheet, thermal pad, or soft thermal interface pad. It is applied between heat-generating components and heatsinks, serving to fill micro-gaps at the interface, replacing air—which has poor thermal conductivity—and thereby reducing thermal resistance and improving heat transfer efficiency.
The pad is composed of a liquid polymer matrix and thermally conductive fillers. Through mixing and coating processes, the material is transformed into a solid thermal pad.
- Insulating, flame retardant, temperature resistant, low oil leakage, soft and compressible
- Comply with EU RoHS prohibition and restriction of hazardous substances regulations RoHS 2.0
Usage Scenarios
Specification
| Item | Unit | CoolerAF® S03 Series | CoolerAF® S05 Series | CoolerAF® S08 Series |
|---|---|---|---|---|
| Thickness (Customizable) | mm | 0.5～6.0 | 0.5～6.0 | 0.5～6.0 |
| Thickness Tolerance | % | ±5 | ±5 | ±5 |
| Thermal Conductivity* | W/m·K | 3.0 | 5.0 | 8.0 |
| Hardness (Customizable) | Shore OO | 10-60 | 20-60 | 50-80 |
| Release Film | - | (Customizable) | (Customizable) | (Customizable) |
| Backing Adhesive | - | (Customizable) | (Customizable) | (Customizable) |
| Volume Resistivity | Ω⋅cm | >5×1013 | >5×1013 | >5×1013 |
| Breakdown Voltage | KV/mm | >5.0 | >5.0 | >5.0 |
*Hot disk method, ISO 22007-2, TPS 500 S.
Pack Size
Sheet form; custom die-cut dimensions available
