B. Thermal Pad

Cooler Assemble Film, CoolerAF® S Series, Si-Gap Pad

CoolerAF® S Series silicone-based thermal gap pads are soft, compressible solid thermal interface materials (TIMs). They conform to surface irregularities between heat-generating components and heat sinks, displacing low-conductivity air gaps to help reduce interfacial thermal resistance and improve heat transfer. Made from silicone-based polymers and thermally conductive fillers through mixing and coating processes, the pads are available in different thermal conductivity grades, thicknesses and hardness levels to meet assembly requirements.

Key Material Features

01 Conformable Gap Filling

Conforms to surface height variations to improve contact between components and heat sinks.

02 Thermal & Electrical Performance

Combines heat transfer with electrical insulation and heat-resistance capabilities.

03 Flame-Retardant & Low-Bleed Design

Formulated with attention to flame retardancy and low oil bleeding.

04 Customizable Options

Thickness, hardness, pull-tab film and adhesive backing options can be customized.

Products comply with applicable EU RoHS restricted-substance requirements; refer to current product documentation for details.

Product Structure

Schematic of a silicone-based thermal gap pad

Application Scenarios

Gap-filling and thermal interface assembly between heat-generating components and heat sinks.

Thermal interface gap-filling illustration

Thermal gap pad applications in electronic equipment

Technical Specifications

Representative specifications for the CoolerAF® S03 / S05 / S08 Series

Property	Unit	CoolerAF® S03 Series	CoolerAF® S05 Series	CoolerAF® S08 Series
Thickness (customizable)	mm	0.5–6.0	0.5–6.0	0.5–6.0
Thickness tolerance	%	±5	±5	±5
Thermal conductivity*	W/m·K	3.0	5.0	8.0
Hardness (customizable)	Shore OO	10–60	20–60	50–80
Pull-tab film	—	Custom	Custom	Custom
Adhesive backing	—	Custom	Custom	Custom
Volume resistivity	Ω·cm	>5 × 10¹³	>5 × 10¹³	>5 × 10¹³
Dielectric breakdown strength	kV/mm	>5.0	>5.0	>5.0

* Thermal conductivity: Hot Disk method, ISO 22007-2, TPS 500 S.

Packaging & CustomizationSheet form; custom die-cut dimensions are available.

Note: The above values are for reference only and are not guaranteed shipment specifications. Refer to the latest Technical Data Sheet (TDS) for each product.

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