Structure
Cooler Assemble Film, CoolerAF® S Series, Si-Gap Pad
A Si-Gap Pad is a solid yet soft thermal interface material, also known as a thermal silicone sheet, thermal pad, or soft thermal interface pad. It is applied between heat-generating components and heatsinks, serving to fill micro-gaps at the interface, replacing air—which has poor thermal conductivity—and thereby reducing thermal resistance and improving heat transfer efficiency.
The pad is composed of a liquid polymer matrix and thermally conductive fillers. Through mixing and coating processes, the material is transformed into a solid thermal pad.
- Insulating, flame retardant, temperature resistant, low oil leakage, soft and compressible
- Comply with EU RoHS prohibition and restriction of hazardous substances regulations RoHS 2.0
Usage Scenarios
Specification
| Item | Unit | CoolerAF® S0320 Series | CoolerAF® S0540 Series | CoolerAF® S0870 Series |
|---|---|---|---|---|
| Color | - | Gray | Green | Purple |
| Thermal Conductivity* | W/m·K | 3.0 | 5.0 | 8.0 |
| Thermal Resistance** | °C-In2/W | <0.40 | <0.40 | <0.40 |
| Hardness | Shore OO | 20±5 | 40±5 | 70±5 |
| Specific Gravity | - | 3.2±0.2 | 3.2±0.2 | 3.2±0.2 |
| Thickness | mm | 0.5~6.0 | 0.75~6.0 | 1.0~6.0 |
| Breakdown Voltage | KV/mm | ≧5.0 | ≧5.0 | ≧5.0 |
| Volume Resistivity | Ω⋅cm | >1013 | >1013 | >1013 |
| Operation Temperature | °C | -40~150 | -40~150 | -40~150 |
| Self-Adhesive | - | Double-Sided Adhesive | Double-Sided Adhesive | Double-Sided Adhesive |
*Hot disk method, ISO 22007-2, TPS 500 S. ** Hot plate method, ASTM D5470, LW-9389.
Pack Size
Sheet form; custom die-cut dimensions available
