Products

C. Thermal / Composite Materials

Structural Adhesive

Structural adhesive refers to a type of adhesive material with high adhesion strength that is used on various engineering components to replace traditional welding or bolts and other joining methods to facilitate the assembly of engineering components.

Structural adhesive is applied to adhere metal and plastic components. After bonding and curing, the finished product can withstand larger loads and has excellent heat resistance, atmospheric aging resistance, vibration fatigue resistance, low creep and high Long-lasting strength. Structural adhesives are mostly composed of polymers with a three-way cross-linked structure, supplemented with tougheners or inorganic fillers. Structural adhesives can be divided into the following categories according to the resin type, adhesive strength and curing method of the material.

  • Comply with EU RoHS prohibition and restriction of hazardous substances regulations RoHS 2.0.
  • Double curing mechanism to avoid incomplete curing in shadow areas.
  • Rapid light curing, providing short-term placement of bonded engineering parts.
  • Low halogen content, chlorine content <100ppm.

Selection Guide

Item STIFBONDTM GF-736S STIFBONDTM CF-I36R STIFBONDTM CF-JB6Q
Materials Acrylic
Appearance Milky white black viscous liquid White liquid
Composition Single component
Curing Mechanism UV + thermal dual curing Low temperature thermal curing Low temperature thermal curing
Curing Conditions 365nm UV: 1000 mW/cm² *3sec 
+ heat 120 oC *30min, 100 oC *30min
85 oC*60 min 120 oC*60 min
Coefficient of Expansion 23 ppm/K 38 ppm/K -
Packaging 30/55 cc syringe
Storage 0~5°C 😄

Product Series

UV + Thermal Dual-Cure Structural Adhesive|GF-736S

 

Key Features

  • Rapid UV pre-curing for precise alignment and fixation
  • Dual-cure mechanism ensures complete curing in shadowed areas
  • Halogen-free, RoHS 2015/863/EU compliant
  • One-component system, refrigerated storage at 5°C

Typical Applications

  • Dissimilar material bonding (Al / Cu / Steel / Plastic)
  • Automotive camera module and base sealing
  • ADAS module encapsulation

Curing Conditions

  • UV:365 nm,1000 mW/cm² × 3 sec
  • Thermal curing:120°C × 30 min, 100°C × 60 min

Specification

Item Unit GF-736S 
Specific gravity (Before/After Curing) (DENSIMETER MD-300S, ASTM D297-93-16) - 1.75/1.79
Viscosity (Anton Paar Viscometer, #T-F Bar @ 50rpm)

Pa·s

55±10
Thixotropic coefficient (ASTM Standard D2196) - 3±0.5
Hardness (ASTM D 2240) Shore D 89
Glass transition temperature (Tg) (TMA) oC 175
Shear strength ( GTA method) Aluminum/Aluminum MPa >6.27
Steel/Steel 5.52
Steel/PCB 5.26
PCB/LCP 1.57
Boiling water absorption rate (GTA method, 100oC boiling water x 60min) % 3.7
Coefficient of linear expansion α1 (Evaluation T: -30°C - 40 °C )

ppm/K

23
α2 (Evaluation T: 120°C - 180 °C ) 96

 

Low-Temperature Thermal-Cure Structural Adhesive|CG-136R

 

Key Features

  • Low-temperature thermal curing
  • Halogen-free, RoHS 2015/863/EU compliant
  • One-component system, refrigerated storage at 5°C

Typical Applications

  • Dissimilar material bonding(Al / Cu / Steel / Plastic)
  • Suitable for heat-sensitive electronic assemblies

Curing Conditions

  • 85°C × 60 min

Specification

Item Unit CF-I36R
Specific gravity (DENSIMETER MD-300S, ASTM D297-93-16) - 1.62/1.65
Viscosity (Anton Paar Viscometer, #T-F Bar @ 50rpm)

Pa·s

40±10

Thixotropic coefficient (ASTM Standard D2196)

- 5±0.5
Shore Hardness (ASTM D 2240) Shore D 80
Glass transition temperature (Tg) (TMA) °C 120
Shear strength ( GTA method, ) Aluminum/Aluminum MPa >6.27
Steel/Steel >6.27
PCB/PCB 5.55
 LCP/LCP 1.47
Boiling water absorption rate % 3
Coefficient of linear expansion (TMA) α1 (Evaluation T: -30°C - 40 °C )

ppm/K

39
α2 ( Evaluation T: 100°C - 150 °C ) 142

 

Low-Temperature Thermal-Cure Structural Adhesive|CF-JB6Q

 

Key Features

  • Low-temperature thermal curing
  • Halogen-free, RoHS 2015/863/EU compliant
  • One-component system, refrigerated storage at 5°C

Typical Applications

  • Dissimilar material bonding(Al / Cu / Steel / Plastic)
  • Suitable for heat-sensitive electronic assemblies

Curing Conditions

  • 120°C × 60 min

Specification

Item Unit CF-JB6Q
Specific gravity (DENSIMETER MD-300S, ASTM D297-93-16) - 1.45
Viscosity (Anton Paar Viscometer, #T-F Bar @ 50rpm)

Pa·s

60±10

Thixotropic coefficient (ASTM Standard D2196)

- 5±0.5
Shore Hardness (ASTM D 2240) Shore D 83
Glass transition temperature (Tg) (TMA) °C -
Shear strength ( GTA method, ) Aluminum/Aluminum MPa 3.85
Steel/Steel >6.27
PCB/PCB 4.30
 LCP/LCP 0.74
Coefficient of linear expansion (TMA) α1 (Evaluation T: -30°C - 40 °C )

ppm/K

-
α2 ( Evaluation T: 100°C - 150 °C ) -

 

Typical Applications of UV + Thermal Dual-Cure Structural Adhesive GF-736S

① ADAS Component Sealing
(Structural sealing for radar modules, sensor modules, and camera modules))

② Automotive Camera Lens and Base Sealing
(High-precision bonding between lenses and metal / plastic bases)

 

Application Scenarios of UV + Thermal Dual-Cure Structural Adhesive GF-736S

Active Alignment (AA)Process

Suitable for high-precision optical module assembly and alignment applications.

Steps:

  1. Plasma Cleaning of the Lens Surface
    Increases surface energy and enhances adhesive bonding strength.
  2. Adhesive Dispensing STIFBOND™ GF-736S
    Precise control of adhesive length, width, height, and volume.
  3. Active Alignment
    High-precision X/Y axis alignment using a 6-axis motion platform in combination with alignment patterns.
  4. UV Pre-Curing
    Rapid fixation of component positions to prevent displacement.
  5. Thermal Curing
    Complete curing to achieve final structural strength and long-term reliability.
關閉

建議您使用以下瀏覽器觀看本網站,
以獲得最佳瀏覽效果。

要下載瀏覽器,請直接點擊以下: