Four Structural Adhesive Material Platforms
Find the right material platform based on processing conditions and application requirements.
01
BH-K36XFast Assembly Platform
Fast Assembly
Chemistry
Two-Component Acrylic (2K Acrylic)
Process / Key Features
Rapid room-temperature curing
Target Applications
Metal enclosures, brackets, and structural reinforcements
Design Objective
Shorter assembly time and greater production efficiency
02
CF-I36RLow-Temperature Curing Platform
Low-Temp Precision
Chemistry
One-Component Acrylic (1K Acrylic)
Process / Key Features
Low-temperature thermal curing; precision dispensing
Target Applications
PCBs, heat-sensitive electronic components, and compact precision modules
Design Objective
Reduced thermal load and improved dispensing precision
03
GF-736SActive Alignment Platform
Active Alignment
Chemistry
Dual-Cure Epoxy Acrylate
Process / Key Features
UV pre-fixation in seconds, followed by thermal post-curing
Target Applications
Optical communication modules, CPO/FAU, and precision lenses
Design Objective
Low shrinkage and dimensional stability
04
CF-JB6QHigh-Toughness Structural Platform
High Robustness
Chemistry
Toughened Acrylic
Process / Key Features
High shear strength, non-sag properties, and thermal curing
Target Applications
Large dissimilar-material structures, heat-dissipation and power modules
Design Objective
Improved vibration resistance and bond reliability
Product Selection Guide
Select products by curing method and key application requirements. Refer to each product specification for detailed material properties.










