Wafer Tape

Back-Grinding Tape

Before IC packaging, wafers must be thinned by back grinding. Wafer Back Grinding Tape (BG Tape) is laminated onto the wafer surface to protect circuits, prevent water penetration, and secure wafer stability during grinding. After processing, the tape can be easily removed without residue.

BG Tape Technical Specifications:

Water Penetration Resistance: The tape must prevent water from penetrating into the wafer circuitry during grinding.
Adhesive Residue: Zero residue detection is required after tape removal.
Wafer Warpage: Warpage becomes more critical as the wafer is thinned; specification requires warpage < 6 mm.
TTV (Total Thickness Variation): Particularly stringent for memory devices, with some products requiring TTV < 2 µm.

GTA provides acrylic PET tape and acrylic PO tape, categorized by process requirements as follows

• Conventional Back Grinding (BG) Process: UV-type back grinding tape and non-UV-type back grinding tape

• Dicing Before Grinding (DBG) Process: DBG-specific back grinding tape

• Difference between BG and DBG processes

GTA’s back grinding tapes are designed with a UV-sensitive adhesive layer, gradient modulus structure, and elastic buffer layer, making them suitable for both wire bond wafers and bumping wafers.

Type	Features	Application	Advantages
🌞UV Type BG Tape	UV-sensitive adhesive, adhesion decreases after 365nm LED exposure	Standard back grinding (Wire Bond / Bumping wafers)	Clean removal without residue, suitable for high-cleanliness processes
⚙️Non-UV Type BG Tape	Non-UV adhesive, maintains stable high adhesion	Grinding processes without UV exposure equipment	Easy to use, prevents wafer shifting, low-residue performance
💎DBG Type BG Tape	Special adhesive formulation for DBG process	Dicing Before Grinding (half-cut→back grinding→die separation)	Reduces chipping and warpage, ensures die edge integrity, improves yield

GTA Wafer Back Grinding Tape Product Categories

Back Grinding Tape	UT Series (BG)	UO Series (BG)	UC Series (DBG)	NO Series (BG)	NT Series (BG)
Feature	UV	UV	UV	Non-UV	Non-UV
Adhesive layer	Double layer	Double layer	Double layer	Single layer	Double layer
Adhesive Type	Acrylic	Acrylic	Acrylic	Acrylic	Acrylic
Base Film	PET	PO	Composite PET	PO	PET

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Products

Back-Grinding Tape

GTA provides acrylic PET tape and acrylic PO tape, categorized by process requirements as follows

GTA’s back grinding tapes are designed with a UV-sensitive adhesive layer, gradient modulus structure, and elastic buffer layer, making them suitable for both wire bond wafers and bumping wafers.

GTA Wafer Back Grinding Tape Product Categories