Wafer Back-Grinding Tape

Packaging unit: 300mm*100M, 400mm*100M, 300mm*50M, 400mm*50M

The acrylic PET tape and PO tape is suitable for application in wafer back-grinding manufacture. The adhesive is composed of gradient stacking layers. The layer in contact with Si-wafer shows high adhesion, sensitive to UV-light and easily removable after exposure of 365nm LED. The buffer layer is high elastic modulus and high creep, which would eliminate the warpage of Si-wafer, encapsulate the bump of Si-wafer and preventing water infiltration.

• Stable adhesion force and reduced adhesion after 365nm UV exposure.
• Excellent adhesion, no adhesive residue on substrate in the tape tear-off process.
• The adhesive is composed of modulus gradient layers and the buffer layer is high elastic modulus.