Wafer Dicing Tape

The acrylic PO tape is suitable for application in wafer dicing process. The high modulus adhesive strongly support wafer in the dicing process and avoid chipping or burrs on cut edges. The adhesive layer shows stable adhesion at ambient condition, sensitive to UV-light, easily removable after exposure of 365nm LED without leaving adhesive residue.

• Stable adhesion force and reduced adhesion after 365nm UV exposure.
• With high modulus design, the adhesive strongly wafer in dicing and avoid chipping or burrs on cut edges.
• With excellent elongation performance, no adhesive residue would stay on substrate in the tape tear-off process.