Products

E. Semiconductor Tape

Wafer Dicing Tape

WAFER DICING TAPE
Acrylic-based wafer dicing tape with a polyolefin (PO) backing, designed to support and secure wafers and dies during the dicing process. Exposure to 365 nm UV light reduces adhesion, facilitating subsequent tape removal.
GTA UO-110 wafer dicing tape in a semiconductor dicing application
Wafer Dicing Process Application | UO-110
Stable Support
High-modulus adhesive layer design helps reduce the risk of edge chipping and burr formation during wafer dicing.
UV Debonding
Exposure to 365 nm LED UV light reduces adhesion, facilitating subsequent tape removal.
Stretchability & Removability
The tape offers good stretchability, with an emphasis on minimizing adhesive residue after removal.
GTA PO Tape vs. Conventional PVC Tape | Property Comparison
Structure comparison of GTA PO wafer dicing tape and conventional PVC wafer dicing tape
Schematic comparison of PO and PVC tape structures. Layer thicknesses shown are illustrative; refer to the latest product technical data for actual specifications.
Material Property Comparison
Property GTA PO Tape
UO090 / UO110
Conventional PVC Tape
Company L, D17X
Chlorine Content 0% 50–53%
DEHP Plasticizer 0% 5–10%
Tensile Strength 110 kg/cm² 135 kg/cm²
Elongation at Break 600% 250%
Note: These comparative values are provided for reference only. Material differences and test results depend on the product specifications, test methods, and conditions. They are not guaranteed shipment specifications.
Product Technical Specifications
Property UO090 UO110
Total Tape Thickness (μm) 90 110
Adhesive Layer Thickness (μm) 10 10
Adhesion Before UV Exposure (gf/25 mm) 450 480
Adhesion After UV Exposure (gf/25 mm) 30 30
Tensile Strength, MD (kg/cm²) 300 330
Tensile Strength, TD (kg/cm²) 270 310
Base Film PO PO
Dicing Tape Structure
Schematic of wafer dicing tape layer structure
Standard Supply Sizes
230 mm × 100 m; 330 mm × 100 m
Note: The above values are for reference only and do not constitute guaranteed shipment specifications. Please refer to the latest Technical Data Sheet (TDS) for each product.
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