IC-Package Thermal Grease TIM1|GTA Material Co., LTD.

IC-Package Thermal Grease TIM1

GTA TIM1 is a high-performance thermal interface material (TIM) series designed for IC packaging. It helps fill microscopic gaps between the chip and the heat spreader, reducing interface thermal resistance and supporting efficient heat dissipation.

The series offers two material platforms: silicone-based formulations (TCG Series) and non-silicone acrylic formulations (TCA Series). The appropriate grade can be selected based on packaging processes, reliability requirements, and volatile-content control needs.

TIM1 materials are designed to balance thermal performance, dispensing stability, and packaging process compatibility for high-power ICs, FCBGA packages, AI computing modules, and advanced thermal management applications.

Two Material Platforms

Silicone-Based TIM1 | TCG Series

Thermal Performance, Conformability and Heat Stability

Combines thermal conductivity, low thermal resistance, and flexibility for packaging applications where interface stress and heat reliability matter.

Non-Silicone Acrylic TIM1 | TCA Series

Low Volatility and Packaging Compatibility

An acrylic, non-silicone option designed to meet thermal and low-volatility needs, including silicone-sensitive packaging processes.

Typical Applications：IC packaging / FCBGA / high-power computing chips / AI computing and advanced thermal modules

TIM1 Product and IC Packaging Applications

IC package thermal paste and packaging application illustration

GTA TIM1 thermal interface paste for IC packaging, product and application illustration

Typical TIM1 Packaging Process

Die attach → TIM1 dispensing → heat spreader assembly and pre-cure → final cure → reflow

TIM1 five-step IC packaging process infographic

This process illustration is for reference only. The pressure, pre-cure, and reflow conditions shown in the image do not represent universal curing specifications for all TIM1 grades. Refer to the applicable TDS and package process requirements.

Technical Specifications | Two Material Platforms

Silicone-Based Thermal Paste | TCG Series

High thermal conductivityHeat resistance and long-term thermal stabilityLow thermal resistanceGood flexibility to reduce interface stress

Property	Unit	TCG-388	TCG-551	Test Method
Appearance	—	Gray paste	Gray paste	Visual
Specific Gravity	—	2.2	2.2	ASTM D792
Thermal Conductivity	W/m·K	4.0	5.5	ISO 22007-2
Thermal Resistance	°C·m²/W	0.06	0.06	ASTM D5470
Bond Line Thickness (BLT)	μm	35	30	ASTM D5470
Curing Conditions	°C × min	125°C × 90 min	125°C × 90 min	—

Non-Silicone Acrylic Thermal Paste | TCA Series

High thermal conductivityResistance to platinum catalyst poisoningLong-term thermal reliabilityLow-volatility formulation

Property	Unit	TCA-388	TCA-521	Test Method
Component Type	—	1K	1K	Visual
Appearance	—	Gray paste	Gray paste	Visual
Viscosity	Pa·s	800 ± 300	1,300 ± 300	GTA method (1 rpm)
Specific Gravity	—	2.2	2.3	ASTM D792
Thermal Conductivity	W/m·K	4.8	7.5	Laser Flash
Thermal Resistance	°C·cm²/W	0.10	0.06	ASTM D5470
Bond Line Thickness (BLT)	μm	24	22	ASTM D5470
Hardness	—	Shore OO 80	Shore A 50	ASTM D2240
Modulus at Room Temperature	MPa	0.62	—	DMA (25°C)
Modulus at High Temperature	MPa	0.39	—	DMA (260°C)
Coefficient of Thermal Expansion CTE α1	ppm/°C	41.29	—	TMA (40–50°C)
Coefficient of Thermal Expansion CTE α2	ppm/°C	51.29	—	TMA (180–200°C)
Curing Conditions	°C × min	150°C × 60 min	150°C × 60 min	—

Packaging and Supply：30 mL syringe; custom packaging options available upon request.

Note: The above data are for reference only and do not constitute guaranteed product specifications. Actual specifications are subject to the latest Technical Data Sheet (TDS) for each product.

Products

IC-Package Thermal Grease TIM1