Thermal Grease, TCG Series is suitable for application on IC and metal lid in “Flip Chip” packaging. After thermal curing, the TIM1 exhibits appropriate hardness and elongation characteristics, leading to low void and no delamination at high temperatures. Besides, the thermal cured TIM1 shows high thermal conductivity and low thermal resistance. It can be wildly used in various products, such as CPU, memory IC and microprocessors.
Thermal interface material 1, TIM 1, Thermal Grease, TCG Series
| Item | Unit | TCG-388 | TCG-551 |
|---|---|---|---|
| Appearance | - | Grey paste | Grey paste |
| Specific gravity | - | 2.2 | 2.2 |
| Thermal impedance* | ˚C·m2/W | 0.05 | 0.06 |
| Thermal conductivity** | W/m·K | 4.0 | 5.5 |
| Bond line thickness | µm | 35 | 30 |
| Curing condition | ˚C ｜ min | 125 ｜ 90 | 125 ｜ 90 |
* Hot plate method, ASTM D5470, LW-9389. **Hot disk method, ISO 22007-2, TPS 500 S.
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