Usage Scenarios
IC-Package Thermal Grease TIM1
GTA TIM1 Series is a high-performance Thermal Interface Material (TIM) designed for IC packaging applications. It effectively fills microscopic gaps between the chip and heat spreader, reducing interfacial thermal resistance and enhancing heat dissipation efficiency.
The product lineup includes both silicone-based materials (TCG Series) and non-silicone acrylic-based materials (TCA Series), enabling flexible selection according to packaging processes, reliability requirements, and volatile control conditions.
The TIM1 Series features excellent thermal conductivity, dispensing stability, reflow reliability, and long-term thermal stability, making it suitable for high-power chips, FCBGA, AI computing, advanced packaging, and high-performance thermal management applications.
Specification
Silicone-based TIM1（TCG Series）
- Excellent thermal conductivity performance
- Outstanding heat resistance and long-term thermal stability
- Low thermal resistance characteristics
- Soft and compliant properties for reducing interfacial stress
| Item | Unit | TCG-388 | TCG-551 | Method |
|---|---|---|---|---|
| Appearance | - | Gray paste | Gray paste | Visual |
| Specific gravity | - | 2.2 | 2.2 | ASTM D792 |
| Thermal conductivity | W/m·K | 4.0 | 5.5 | ISO 22007-2 |
| Thermal resistance | ˚C·m2/W | 0.06 | 0.06 | ASTM D5470 |
| Bond line thickness | µm | 35 | 30 | ASTM D5470 |
| Curing conditions | ˚C ｜ min | 125 ｜ 90 | 125 ｜ 90 | – |
Acrylic-based TIM1（TCA Series）
- Excellent thermal conductivity performance
- Platinum poisoning resistance
- Long-term thermal reliability
- Low volatile characteristics
| Item | Unit | TCA-388 | TCA-521 | Method |
|---|---|---|---|---|
| One-component / Two-component | – | 單劑 | 單劑 | Visual |
| Appearance | – | 灰色膏體 | Gray paste | Visual |
| Viscosity | Pa·S | 800 ± 300 | 1300 ± 300 | GTA method（1 rpm） |
| Specific Gravity | – | 2.2 | 2.3 | ASTM D792 |
| Thermal Conductivity | W/m·K | 4.8 | 7.5 | Laser Flash |
| Thermal Resistance | °C·cm²/W | 0.10 | 0.06 | ASTM D5470 |
| Bond Line Thickness | μm | 24 | 22 | ASTM D5470 |
| Hardness | Shore D | 30 | 30 | ASTM D2240 |
| Room Temperature Modulus | MPa | 0.62 | – | DMA（25°C） |
| High Temperature Modulus | MPa | 0.39 | – | DMA（260°C） |
| CTE α1 | ppm/°C | 41.29 | – | TMA（40–50°C） |
| CTE α2 | ppm/°C | 51.29 | – | TMA（180–200°C） |
| Curing conditions | ˚C ｜ min | 150｜ 60 | 150｜ 60 | – |
Pack Size
30 mL / syringe
Customized packaging available
