Usage Scenarios
Usage Scenarios 1
Usage Scenarios 2
Temporary Bonding Materials
Temporary Bonding Materials (TBM) are special adhesives used to temporarily attach wafers or chips to carrier substrates.
During wafer processes such as grinding, RDL formation, exposure, development, etching, sputtering, and plating, TBM provides reliable mechanical support and can be easily removed by heating or solvents after processing.
Main Functions & Principles
• Support: Provides strong adhesion and mechanical stability during grinding and etching.
• Planarity Control: Prevents wafer warpage and maintains excellent TTV for high precision.
• Controlled Debonding: Enables easy separation by heat, laser, or solvent.
• Wide Applications: Suitable for wafer thinning, back grinding, laser dicing, and advanced packaging such as FOWLP.
Material Characteristics
• Polymer-based Matrix: Fast curing with strong bonding strength.
• High Resistance: Excellent thermal (>180°C) and chemical resistance.
• Low Outgassing: Prevents contamination of sensitive components.
Specification
| Item | Water-based UV Curing Coating EN-679 (Hydro-debondable) | Non-water-based UV Curing Coating EZ-D7B (Solvent-debondable) |
| System | Modified acrylic resin / One-component / UV-curable | Modified acrylic resin / One-component / UV-curable |
| Description | Solvent-free, ultra-low VOC, fast adhesion | Solvent-free, ultra-low VOC, fast adhesion |
| Viscosity | 40 ± 5 Pa·s | 120 ± 10 Pa·s |
| Thixotropic Index | 4.5 ± 0.5 | 6.0 ± 0.5 |
| Hardness (Shore D) | 89 | 83 |
| 5% Weight Loss Temp (Td5) | 350 °C | 300 °C |
| Glass Transition Temp (Tg) | 220 °C | 180 °C |
| Hydrolysis Rate @ 25 °C | 15 min | — |
| Hydrolysis Rate @ 80 °C | 3 min | — |
| Solvent Dissolution Rate @ 25 °C (NEP) | — | 5 min |
| Solvent Dissolution Rate @ 25 °C (GBL) | — | 90 min |
| High-Temp Storage Reliability | 250 °C × 5 h, No void, No crack | 250 °C × 2 h，No void, No crack |
Test Conditions and Methods：
Viscosity: Anton Paar Viscometer, #T-E Bar @ 50 rpm
Thixotropic Index: ASTM Standard D2196
Hardness (Shore D): ASTM D2240, TECLOCK DUROMETER
5% Weight Loss Temperature (Td5): TGA, thermal gravimetric analysis, 365 nm LED, 100 mW × 30 sec
Glass Transition Temperature (Tg): TMA, 365 nm LED, 100 mW × 30 sec
Hydrolysis Rate: at 25 and 80 °C, GTA method
Solvent Dissolution Rate b: at 25 °C, in NEP or GBL, GTA method
High-temperature Storage Test: cured stripe sample 0.1 mm × 1 cm × 3 cm
Pack Size
40 g per unit; customization available.
