Products

C. Thermal / Composite Materials

Temporary Bonding Adhesive

Temporary Bonding Adhesives (TBA) temporarily secure wafers or dies to a carrier to support wafer thinning, back grinding, redistribution layer (RDL) processing, lithography, developing, etching, sputtering, and electroplating.
During processing, the adhesive provides mechanical support and bonding stability to help control wafer warpage and total thickness variation (TTV). After processing, a grade-specific water-based or solvent-assisted debonding method enables carrier separation.
Core Technical Features
Reliable Temporary Support
Provides bonding support during wafer thinning and multi-step processing to help protect wafer integrity.
Planarity and Process Compatibility
Helps manage warpage and TTV while addressing thermal, chemical-resistance, and low-outgassing requirements.
Controlled Debonding
Offers hydrolytic and solvent-based debonding options for carrier separation and downstream cleaning.
Two Material Platforms
EN-679 | Hydrolytic Debonding
Water-based UV-curable coating for water-assisted release.
EZ-D7B | Solvent Debonding
Non-aqueous UV-curable coating; removal with solvents such as NEP or GBL.
Typical Applications:Wafer thinning / Back grinding / RDL processes / Advanced packaging (e.g., FOWLP)
Temporary Bonding Adhesives | Application Scenarios
Application Scenario 1 | Process Illustration
TBA temporary bonding application diagram 1
Figure 1. Illustration of a temporary bonding application.
Application Scenario 2 | Application Illustration
TBA temporary bonding application diagram 2
Figure 2. Illustration of a temporary bonding application.
Two Debonding Approaches | Material Selection
Hydrolytic Debonding | EN-679
Water-based UV-curable formulation with a water-assisted release process; representative test temperatures: 25°C and 80°C.
Solvent Debonding | EZ-D7B
Non-aqueous UV-curable formulation suitable for solvent-assisted release using NEP or GBL.
EN-679 / EZ-D7B | Technical Specifications
Representative test data for the two temporary bonding grades.
Property EN-679 | Hydrolytic EZ-D7B | Solvent Debonding
Material and Cure System
System Modified acrylic resin / One-component (1K) / Dual UV + thermal cure Modified acrylic resin / One-component (1K) / Dual UV + thermal cure
Characteristics Solvent-free / Very low volatile content / Fast bonding Solvent-free / Very low volatile content / Fast bonding
Physical and Thermal Properties
Viscosity 40 ± 5 Pa·s 120 ± 10 Pa·s
Thixotropic Index 4.5 ± 0.5 6.0 ± 0.5
Shore D Hardness 89 83
5% Weight-Loss Temperature (Td5) 350°C 300°C
Glass Transition Temperature (Tg) 220°C 180°C
Debonding and High-Temperature Reliability
Hydrolytic Release Time @25°C 15 min —
Hydrolytic Release Time @80°C 3 min —
Solvent Debonding Time @25°C (NEP) — 5 min
Solvent Debonding Time @25°C (GBL) — 90 min
High-Temperature Storage Reliability 250°C × 5 h; no bubbles or cracks 250°C × 2 h; no bubbles or cracks
Test Methods and Conditions
Viscosity
Anton Paar Viscometer; #T-E Bar @ 50 rpm
Thixotropic Index
ASTM D2196
Shore Hardness
ASTM D2240; TECLOCK Durometer
5% Weight-Loss Temperature (Td5)
TGA (thermogravimetric analysis); source also lists 365 nm LED, 100 mW × 30 s
Glass Transition Temperature (Tg)
TMA; source also lists 365 nm LED, 100 mW × 30 s
Hydrolytic Release Time
25°C / 80°C, GTA method
Solvent Debonding Time
25°C, NEP or GBL, GTA method
High-Temperature Storage Test
Cured stripe specimen: 0.1 mm × 1 cm × 3 cm
Packaging and Storage:30 mL syringes; custom packaging available. Refrigerated storage at 0–5°C is recommended. Refer to the product TDS for storage and warm-up instructions.
Note: The above data are for reference only and do not constitute guaranteed shipping specifications. Actual specifications and test conditions are subject to the latest Technical Data Sheet (TDS) for each grade.
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