Usage Scenarios
- Semiconductor packaging thermal bonding
- Electronic component heat dissipation fixation
- Dissimilar material bonding (Al / Steel / Ni / Si / PCB)
- High-temperature thermal management and structural bonding
Thermally conductive adhesive (Lid Adhesive)
CV series are acrylic-based thermally conductive adhesives (Lid Adhesive) designed for high-temperature curing applications. They provide excellent thermal conductivity, strong adhesion strength, and reliable high-temperature performance. With suitable viscosity and thixotropic properties at room temperature, these materials are ideal for electronic packaging, dissimilar material bonding, and heat dissipation fixation applications.
Specification
Features
- One-component heat-curing system
- Excellent thermal conductivity and high-temperature reliability
- Fast curing adhesion
- Halogen-free and compliant with RoHS 2015/863/EU
- One-component refrigerated storage at +5°C
| Item | Unit | CV-886 | CV-886-1 | Method | ||
|---|---|---|---|---|---|---|
| Material properties | 单剂/双剂 | - | 單劑 | 單劑 | - | |
| Appearance | - | 灰色膏狀 | 灰色膏狀 | 目視 | ||
| Viscosity | Pa·s | 76 | 105 | GTA method (50rpm) | ||
| Thixotropic Index | - | 3.9 | 3.8 | GTA method (50/5rpm) | ||
| Specific Gravity | - | 2.0 | 2.1 | ASTM D792 | ||
| Curing Condition | ˚C ｜ min | 150 ｜ 60 | 150 ｜ 60 | Air circulating oven | ||
| Manufacturing properties | Shear Strength @25°C | Al/Al | MPa | >10 | >10 | ISO 4587-1979 |
| Ni/Ni | >10 | >10 | ||||
| Ni/PCB | >10 | >10 | ||||
| High Temp Shear Strength @200°C | Ni/Ni | 2.82 | 2.33 | |||
| Thermal Conductivity | W/m·K | 1.8 | 2.5 | Hot Disk | ||
| CTE | α1 | ppm/°C | 51.8 | - | TMA (40-50 °C) | |
| α2 | ppm/°C | 70.8 | - | TMA (180-200 °C) | ||
| Modulus | @25°C | MPa | 31.2 | - | DMA (25 °C) | |
| @260°C | MPa | 14.5 | - | DMA (260 °C) | ||
| Hardness | Shore D | 80 | 83 | ASTM D2240 | ||
Pack Size
50 mL / syringe
Customized packaging available
