IC Package Thermal Adhesive | Application
Illustrative lid-to-package bonding application; actual material placement depends on the package design.
Applications
01Thermally conductive adhesive bonding in IC packages
02Attachment of electronic components to heat-management structures
03Dissimilar-material bonding: metals and PCB (Al, Steel, Ni, Si, PCB)
04Thermal and structural attachment in elevated-temperature environments
Material Features
One-component, heat-curable acrylic system Designed for thermal conduction and high-temperature reliability Heat-curable adhesive bonding Halogen-free; RoHS 2015/863/EU compliant (subject to product documentation) Recommended refrigerated storage at approximately 5°C (see the latest TDS)
CV Series | Technical Specifications
Representative test data for CV-886 and CV-886-1
Uncured Material Properties and Cure Conditions
| Property | Unit | CV-886 | CV-886-1 | Test Method |
|---|---|---|---|---|
| Components | — | 1K | 1K | — |
| Appearance | — | Gray paste | Gray paste | Visual |
| Viscosity | Pa·s | 76 | 105 | GTA method (50 rpm) |
| Thixotropic Index | — | 3.9 | 3.8 | GTA method (50/5 rpm) |
| Specific Gravity | — | 2.0 | 2.1 | ASTM D792 |
| Thermal Cure | °C × min | 150°C × 60 min | 150°C × 60 min | Air circulating oven |
Cured Properties | Mechanical and Thermal
| Property | Unit | CV-886 | CV-886-1 | Test Method |
|---|---|---|---|---|
| Shear Strength @25°C: Al/Al | MPa | >10 | >10 | ISO 4587-1979 |
| Shear Strength @25°C: Ni/Ni | MPa | >10 | >10 | ISO 4587-1979 |
| Shear Strength @25°C: Ni/PCB | MPa | >10 | >10 | ISO 4587-1979 |
| Shear Strength @200°C: Ni/Ni | MPa | 2.82 | 2.33 | ISO 4587-1979 |
| Thermal Conductivity | W/m·K | 1.8 | 2.5 | Hot Disk |
| Coefficient of Thermal Expansion, CTE α1 | ppm/°C | 51.8 | — | TMA (40–50°C) |
| Coefficient of Thermal Expansion, CTE α2 | ppm/°C | 70.8 | — | TMA (180–200°C) |
| Modulus @25°C | MPa | 31.2 | — | DMA (25°C) |
| Modulus @260°C | MPa | 14.5 | — | DMA (260°C) |
| Shore Hardness | Shore D | 80 | 83 | ASTM D2240 |
Packaging and Storage：50 mL syringe; customized packaging options are available. Refrigerated storage at approximately 5°C is recommended for this one-component material; refer to the latest TDS for detailed storage and warm-up conditions.
Note: These values are for reference only and do not constitute guaranteed shipment specifications. Actual product specifications are subject to the latest Technical Data Sheet (TDS). Regulatory compliance claims are subject to the applicable product test reports or declarations.
