Application｜Plasma Dicing Process Flow
Illustrative flow showing protective coating, laser grooving, plasma dicing and cleaning.
The laser grooving and plasma dicing conditions in the illustration are examples only and should not be interpreted as guaranteed operating conditions for AWL079L.
Process Comparison｜Plasma vs. Conventional Dicing
| Criterion | Plasma Dicing | Blade Dicing | Laser Dicing |
|---|---|---|---|
| Kerf width | As low as <3 μm | 20–40 μm | Approx. 10–20 μm |
| Stress / cracking | Very low mechanical stress | Higher; edge chipping may occur | Heat-affected microcracks may occur |
| Suitable substrate thickness | Thin wafers and brittle substrates | Thicker silicon wafers | Thin substrates |
| Throughput | Suitable for parallel batch-pattern processing | Sequential cutting along streets | Sequential scanning |
| Cost | Higher initial equipment cost; potentially low cost at volume | Medium | Medium to high |
Note: This table summarizes the general process comparison shown in the original illustration. It does not represent AWL079L-specific test results. Kerf, throughput, cost and substrate compatibility depend on equipment and process conditions.
AWL079L｜Technical Specifications
Representative physical-property and appearance data from the current source.
| Property | AWL079L |
|---|---|
| pH | 7.0 ± 0.5 |
| Viscosity (cP) | 100 ± 50 |
| Thixotropic Index (T.I.) | — |
| S.C. (%) / 1.5 h | 25 ± 5 |
| Absorbance (@355 nm) | 60 |
| Transmittance (T%) | >85 |
| Haze (%) | 2 |
| Lab color value L* | 93 |
| Lab color value a* | — |
| Lab color value b* | — |
| Appearance | Pale yellow liquid |
Packaging and Storage5 L and 20 L HDPE containers.
Note: The values above are for reference only and are not guaranteed shipment specifications. Refer to the latest Technical Data Sheet (TDS) for each product.
