Non-UV Type BG Tape|GTA Material Co., LTD.

Non-UV Type BG Tape

Back grinding tapes protect the circuit side of the wafer while providing water resistance, cushioning, and fixation during thinning. The Non-UV group includes the NO and NT families and does not require UV debonding equipment.

Process Protection

Helps prevent grinding-water ingress and wafer movement.

Cushioning and Warpage Control

Adhesive and buffer structures accommodate bump profiles and mechanical stress.

Non-UV Removal

Suitable for processes without UV release equipment; peel temperature and conditions should be evaluated.

Process and Application

Wafer back grinding process illustration

NO Family | General and Bumped-Wafer Protection

Specification	NO205-BC	NO170-TC	NO130-TC
Adhesive Thickness (μm)	40	70	30
Backing Thickness (μm)	165	100	100
Backing Material	PO	PO	PO
Wafer Adhesion @25°C (gf/inch)	150	200	150
Wafer Adhesion @50°C (gf/inch)	40	<50	<50
Primary Application	Wire-bond wafer	Small-bump wafer	Wafer protection

NT Family | Thick Adhesive for Bumped Wafers

Specification	NT595-DL
Adhesive Thickness (μm)	520
Backing Thickness (μm)	75
Backing Material	PET
Wafer Adhesion @25°C (gf/inch)	150
Wafer Adhesion @50°C (gf/inch)	<50
Primary Application	Large-bump wafer protection

Typical Supply Sizes

230/330 mm × 50/100 m (subject to grade and order confirmation)

Note: The above values are for reference only and do not constitute guaranteed shipment specifications. Refer to the latest TDS for actual product specifications.

Products

Non-UV Type BG Tape