Non-UV Type BG Tape

Before IC packaging, wafers must be thinned by back grinding. Wafer Back Grinding Tape (BG Tape) is laminated onto the wafer surface to protect circuits, prevent water penetration, and secure wafer stability during grinding. After processing, the tape can be easily removed without residue.

Features:

• High adhesion & water resistance: Prevents grinding water penetration.
• Gradient modulus structure: Provides both cushioning and secure fixation.
• High-creep buffer layer: Effectively absorbs stress, reduces warpage, and accommodates bump structures.
• High reliability: Meets specifications for warpage, TTV, and adhesive residue, while maintaining stable high adhesion to prevent wafer shifting during grinding.
• Special applications: Suitable for processes without UV exposure equipment.