DBG Type BG Tape

Before IC packaging, wafers must be thinned by back grinding. Wafer Back Grinding Tape (BG Tape) is laminated onto the wafer surface to protect circuits, prevent water penetration, and secure wafer stability during grinding. After processing, the tape can be easily removed without residue.

Features:

• Special application: Designed for the DBG (Dicing Before Grinding) process, capable of withstanding multiple steps including half-cutting → back grinding → die separation.
• Gradient modulus structure: Special formulation reduces backside chipping and wafer warpage.
• High reliability: Ensures die edge integrity after grinding and improves overall yield.