Process and Application
01
Partial Dicing
02
Back Grinding
03
Die Separation
UC Family | DBG Process
| Specification | UC165-DL |
|---|---|
| Adhesive Thickness (μm) | 85 |
| Backing Thickness (μm) | 80 |
| Backing Material | Composite PET |
| Adhesion Before UV (gf/inch) | 1800 |
| Adhesion After UV (gf/inch) | 30 |
| Primary Application | DBG / UV-release / thin-wafer protection |
Typical Supply Sizes
230/330 mm × 50/100 m (subject to grade and order confirmation)
Note: The above values are for reference only and do not constitute guaranteed shipment specifications. Refer to the latest TDS for actual product specifications.
