UV Type BG Tape

Before IC packaging, wafers must be thinned by back grinding. Wafer Back Grinding Tape (BG Tape) is laminated onto the wafer surface to protect circuits, prevent water penetration, and secure wafer stability during grinding. After processing, the tape can be easily removed without residue.

Features:

• High adhesion & water resistance: Prevents grinding water penetration.
• UV-reduced adhesion: Adhesion decreases after 365nm LED exposure, enabling easy peel-off without residue.
• Gradient modulus structure: Balances cushioning and secure fixation.
• High-creep buffer layer: Effectively absorbs stress, reduces wafer warpage, and accommodates bump structures.
• High reliability: Meets strict specifications for warpage, TTV, and adhesive residue.