UV Type BG Tape|GTA Material Co., LTD.

UV Type BG Tape

UV-release back grinding tapes maintain adhesion during thinning and can be debonded after UV exposure. The offering includes UT grades and UO210-DL; selection depends on adhesive thickness, backing, and wafer bump structure.

Grinding Fixation

Provides holding and protection during processing.

Low Adhesion after UV

UV exposure reduces peel adhesion and removal load.

Thickness Options

Different adhesive thicknesses accommodate bump structures and grinding conditions.

Process and Application

Wafer back grinding process illustration

UT Family | UV-Release Back Grinding

Specification	UT170-DL	UT260-DL	UT440-DL
Adhesive Thickness (μm)	120	210	365
Backing Thickness (μm)	50	50	50
Backing Material	PET	PET	PET
Adhesion Before UV (gf/inch)	1350	1800	450
Adhesion After UV (gf/inch)	15	30	40
Primary Application	Small-bump protection	Medium-bump protection	Large-bump protection

UO Family | UV-Release Back Grinding

Specification	UO210-DL
Adhesive Thickness (μm)	110
Backing Thickness (μm)	100
Backing Material	PO
Adhesion Before UV (gf/inch)	1300
Adhesion After UV (gf/inch)	30
Primary Application	Small-bump protection

Typical Supply Sizes

230/330 mm × 50/100 m (subject to grade and order confirmation)

Note: The above values are for reference only and do not constitute guaranteed shipment specifications. Refer to the latest TDS for actual product specifications.

Products

UV Type BG Tape