Structure
Cooler Assemble Film, CoolerAF® A Series, Acrylic-Gap Pad
CoolerAF® A Series Acrylic Gap Pads are flexible and soft thermal interface materials composed of modified thermally conductive fillers and an acrylic polymer matrix. These pads deliver excellent thermal conductivity, low outgassing, and high thermal stability. Given these properties, acrylic gap pads enable efficient heat dissipation in electronic modules such as integrated circuits (ICs) and semiconductor chips, helping to maintain long-term performance and reliability of electronic devices.
- Comply with EU RoHS prohibition and restriction of hazardous substances regulations RoHS 2.0
- Insulating, flame retardant, temperature resistant
- Low hardness, soft and compressible
Usage Scenarios
Specification
| Item | Unit | CoolerAF® A0315 Series | CoolerAF® A0650 Series | CoolerAF® A0860 Series |
|---|---|---|---|---|
| Color | - | Gray/White/Blue/- | Gray/White/Blue/- | Gray/White/Blue/- |
| Thermal conductivity* | W/m·K | 3.0 | 6.0 | 8.0 |
| Thermal Resistance** | °C-In2/W | 0.4 | 0.3 | 0.2 |
| Hardness | Shore OO | 15±5 | 50±5 | 60±5 |
| Specific Gravity | - | 2.8±0.2 | 3.3±0.2 | 3.3±0.2 |
| Thickness | mm | 0.5~2.0 | 0.5~2.0 | 0.5~2.0 |
| Breakdown Voltage | KV/mm | ≧5.0 | ≧5.0 | ≧5.0 |
| Volume Resistivity | Ω⋅cm | >1013 | >1013 | >1013 |
| Bond Line Thickness @40 psi | mm | 0.25 | 0.61 | 0.61 |
| Compressibility*** | % | 30 | 30 | 30 |
*Hot disk method, TPS 500 S. ** Hot plate method, ASTM D5470, LW-9389. *** Hot plate method, ASTM D5149, LW-9389.
Pack Size
Sheet form; custom die-cut dimensions available
