Product Structure
Schematic of a non-silicone acrylic thermal gap pad
Application Scenarios
Thermal gap filling between electronic components, semiconductor chips and heat sinks.
Non-silicone thermal pad placement and heat-sink assembly
Thermal gap pad applications in electronic equipment
Technical Specifications
Representative specifications for the CoolerAF® A03 / A05 / A08 Series
| Property | Unit | CoolerAF® A03 Series | CoolerAF® A05 Series | CoolerAF® A08 Series |
|---|---|---|---|---|
| Thickness (customizable) | mm | 0.5–6.0 | 0.5–6.0 | 0.5–6.0 |
| Thickness tolerance | % | ±5 | ±5 | ±5 |
| Thermal conductivity* | W/m·K | 3.0 | 5.0 | 8.0 |
| Hardness (customizable) | Shore OO | 10–60 | 20–60 | 50–80 |
| Pull-tab film | — | Custom | Custom | Custom |
| Adhesive backing | — | Custom | Custom | Custom |
| Volume resistivity | Ω·cm | >5 × 1013 | >5 × 1013 | >5 × 1013 |
| Dielectric breakdown strength | kV/mm | >5.0 | >5.0 | >5.0 |
* Thermal conductivity: Hot Disk method, ISO 22007-2, TPS 500 S.
Packaging & CustomizationSheet form; custom die-cut dimensions are available.
Note: The above values are for reference only and are not guaranteed shipment specifications. Refer to the latest Technical Data Sheet (TDS) for each product.
