Structure
Cooler Assemble Film, CoolerAF® A Series, Acrylic-Gap Pad
CoolerAF® A Series Acrylic Gap Pads are flexible and soft thermal interface materials composed of modified thermally conductive fillers and an acrylic polymer matrix. These pads deliver excellent thermal conductivity, low outgassing, and high thermal stability. Given these properties, acrylic gap pads enable efficient heat dissipation in electronic modules such as integrated circuits (ICs) and semiconductor chips, helping to maintain long-term performance and reliability of electronic devices.
- Comply with EU RoHS prohibition and restriction of hazardous substances regulations RoHS 2.0
- Insulating, flame retardant, temperature resistant
- Low hardness, soft and compressible
Usage Scenarios
Specification
| Item | Unit | CoolerAF® S03 Series | CoolerAF® S05 Series | CoolerAF® S08 Series |
|---|---|---|---|---|
| Thickness (Customizable) | mm | 0.5～6.0 | 0.5～6.0 | 0.5～6.0 |
| Thickness Tolerance | % | ±5 | ±5 | ±5 |
| Thermal Conductivity* | W/m·K | 3.0 | 5.0 | 8.0 |
| Hardness (Customizable) | Shore OO | 10-60 | 20-60 | 50-80 |
| Release Film | - | (Customizable) | (Customizable) | (Customizable) |
| Backing Adhesive | - | (Customizable) | (Customizable) | (Customizable) |
| Volume Resistivity | Ω⋅cm | >5×1013 | >5×1013 | >5×1013 |
| Breakdown Voltage | KV/mm | >5.0 | >5.0 | >5.0 |
*Hot disk method, ISO 22007-2, TPS 500 S.
Pack Size
Sheet form; custom die-cut dimensions available
