Advanced Packaging Cleaning Applications
Select the cleaning formulation and process conditions based on the package geometry and residue characteristics.
01Copper-Pillar Flip-Chip
Supports organic flux-residue cleaning around copper pillars and interconnects.
022.5D / 3D IC Packaging
Addresses cleaning needs associated with high-density and complex package structures.
03Fine-Pitch / Narrow-Gap
Combines wetting and penetration to improve contact with confined features.
Technical Specifications
Representative physical-property data for FC-102, FC-102T and FC-168 to support process selection and evaluation.
| Property | Unit | FC-102 | FC-102T | FC-168 |
|---|---|---|---|---|
| pH | — | 11.5 ± 1 | 9–12 | 13 ± 1 |
| Viscosity | cP @ 25°C | 3.5 ± 0.5 | 3 ± 2 | 10.5 ± 2 |
| Specific Gravity | — | 1.00 ± 0.01 | 1.00 ± 0.01 | 1.05 ± 0.01 |
| Surface Tension | mN/m | 29 ± 2 | 29 ± 2 | 27 ± 2 |
| Water Solubility | — | Y | Y | Y |
Packaging20 L HDPE container.
Note: The values above are for reference only and are not guaranteed shipment specifications. Refer to the latest product Technical Data Sheet (TDS) for actual specifications.
Verify material compatibility and cleaning performance with the actual substrates, flux chemistry and process conditions.
